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Sample applications
| Semiconductor | Electronic Component Mounting | Automatic assembly | Consumer electronics/OA |
| Metal processing | Steel/Ceramic | Delivery/Transportation | Logistics | Automobile | Textile |
| Rubber/Plastic | Printing | Packaging/Food/Drug | Safety | Sanitary/Amusement | etc. |

Electronic Component Mounting

Plate detection

Even if the detective object and background material is same. Pulse amplifier can detect small difference of light volume.

Detection of passage of boards

Boards are detected on insertion machine. Fiber optic cable with allowable bending radius of 1 mm can be installed virtually anywhere.

Detection of defects in capacitors

Bends above taping detected with through-beam type fiber optic cable.

Detection of lifting of tape feeder

Lifting of any one of ten feeders in line can be detected.

Capacitor pass/fail check

Fiber optic cable embedded in guide for detection.

Board detection

Boards detected in insertion machine by limited reflection method, unaffected by board color or background.

Checking of presence of silver paste

Even a small amount of paste can be detected with a spot size of 0.5 mm in diameter.

Detection of lead frame plating

Reliable detection achieved by determination of RGB color component and brightness.

Checking for upside-down electronic components

Blue light fiber optic sensor used for determining whether the right sides of electronic components are facing up in part chute.

PCB detection

Ultra-thin sensor allowing installation virtually anywhere.

Positioning of mounter head

Ultra-thin sensor for space saving in head positioning.

Counting of minute parts

Wide area fiber optic cable allowing wide-view detection.

Geometric defect inspection

Missing parts on boards, etc. detected.

Electronic component detection

Molded parts detected with background suppression photo sensor unaffected by color variation.

Positioning of hybrid boards

High-precision positioning achieved with micro-spot laser beam.

Positioning of PCBs

Stop position of PCBs determined with U-shaped through-beam type photo sensors that are unaffected by color, gloss and warp of boards.

Quantity/position check

Quantity and position of work in view checked.

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