ASW-SG Series
Wafer mapping sensor
- To detect Silicon Carbide, Sapphire, Silicon and other translucent wafers.
- Applicable to 6, 8 and 12 inch wafers
- Translucent wafer mode (8 and 12 inch models)
- Free from Electrostatic effects (comb sensor unit)
- Standard・Official Approval
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- Download
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ASW-SG Series Lineups
| Model | Type | Power supply | Detection method | Detecting distance Min (mm) | Detecting distance (mm) | Control output | Light source | Connection | Use application | Download |
|---|---|---|---|---|---|---|---|---|---|---|
ASW-SG625AP 
|
Glass wafer detection | 24VDC | Through beam | NPN | Infrared LED | Attached cable with connector | semiconductor / LCD | |||
|
ASW-SG85F
|
Glass wafer detection | 24VDC | Through beam | NPN | Infrared LED | Attached cable with connector | semiconductor / LCD | |||
|
ASW-SG85F-Y05
|
Glass wafer detection | 24VDC | Through beam | NPN | Infrared LED | Attached cable with connector | semiconductor / LCD | |||
|
ASW-SG86F
|
Glass wafer detection | 24VDC | Through beam | NPN | Infrared LED | Attached cable with connector | semiconductor / LCD | |||
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ASW-SG86F-Y05
|
Glass wafer detection | 24VDC | Through beam | NPN | Infrared LED | Attached cable with connector | semiconductor / LCD | |||
|
ASW-SG125VF
|
Glass wafer detection | 12-24VDC | Through beam | NPN | Infrared LED | Connector type | semiconductor / LCD |
Feature
The wafer mapping sensor speeds up the sensing process while maintaining relaiable detection.
Dimension
ASW-SG625AP
The dimension shown in these drawingapply to the bottom end (※2), not the protrusion end (※1) of the comb.
ASW-SG85F
ASW-SG85F-Y05
ASW-SG86F
ASW-SG86F-Y05
The dimension shown in these drawingapply to the bottom end （※2）, not the protrusion end（※1） of the comb.
ASW-SG125VF
The dimension shown in these drawingapply to the bottom end (※2), not the protrusion end (※1) of the comb.
Comb sensor unit
ASW-F2500
Comb sensor unit
ASW-F1600
Circuit
ASW-SG625AP
ASW-SG85F
ASW-SG86F
ASW-SG85F-Y05
ASW-SG86F-Y05
ASW-SG125VF
（For a noise prevention, a capacitor is installed between the 0V power supply and the sensor’s aluminum case.
Do not conduct withstand voltage Test between any input / output and the sensor case. ）
External wiring and connector number
Semiconductor
Collective detection of wafers
Presence of wafers in cassette collectively checked for mapping.
Semiconductor
Detection of translucent wafers
Simultaneously detects all the translucent wafers etc in cassette by latch mode. Through beam method is adopted for reliable detection.
